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Advanced Materials Processing - Lapping & Polishing (Microtech)
Engis is a global leader in the microfinishing and planarization of advanced materials such as silicon carbide, sapphire, and III-V Nitrides.
Leveraging our manufacturing technologies as a diamond micronizer, leading producer of lapping slurries, and machine tool builder, Engis is in a unique situation to engineer processing solutions. We have complete in-house capability to design and manufacture the equipment as well as the consumables needed to achieve the objective.
With the skilled technicians in our specialized process development laboratory Engis works hand-in-hand with research centers and manufacturers on all types of advanced materials. Drawing on resources from all over the world, Engis truly has global expertise to offer its customers.
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Consumables
Engis is a pioneer in the use of free abrasive diamond products and specifically formulated slurries to replace CMP in the processing of advanced materials.
Diamond is a significantly sharper and more durable abrasive than aluminas which leads to a more efficient process. Diamond is the most efficient media for chemically resistant and hard materials which can prove to be difficult to polish with CMP vehicles.
This increase in processing efficiency leads to reduced slurry consumption and waste disposal, the virtual elimination of expensive pads, and lower cycle times. These benefits translate into lower costs to the manufacturer.
The carrier Engis utilizes with its diamond particles will not set up on the wafer as colloids do, and does not require special cleaning steps after processing. The end result is a cleaner, more efficient process.
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Materials
Diamond is particularly well suited for grinding, lapping, and polishing many Advanced Materials which are difficult to efficiently process with conventional abrasives.
Some of the materials which Engis has developed diamond processes for include:
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Silicon Carbide
- 4H and 6H substrates up to 100mm
- CVD SiC Mirrors
- Pressed and Sintered Material
Sapphire
- C, A, and R-planes
- Epitaxial Finishing for substrates
- Back Finishing to <50 um
GaN
AlTiC
- Disk head lapping
- Back Finishing
Silicon
- 100 and 110 Planes
- Optics
- Epitaxial Finishing
- Back Finishing
Silicon Germanium
- Planarization
- Epitaxial Finishing
Gallium Arsenide (GaAs)
Indium Phosphide
- Epitaxial Finishing
- Back Finishing
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Germanium
- Epitaxial Finishing
- Back Finishing
YAG
Calcium Fluoride (CaF2)
Magnesium Fluoride (MgF2)
Potassium Titanate (lcTP) Phosphate
- Wave Guide Crystal Polishing
Zirconia
- Thickness < 50 um
- TTV < 3um
Titanium (MEMS)
- Epitaxial Finishing
- Thickness <30 um
- TTV <3 u
Nickel (MEMS)
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The Engis staff of Senior Scientists and Researchers comes from the fields of Material Science, Chemistry, Physics, and Mechanical Engineering. With these combined disciplines and their practical industry experience they work together to bring you the products and processes for the most demanding applications.
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Engis has established a Microfinishing Technology Center as a resource to:
- Solve difficult application problems
- Attain the tightest finish and flatness tolerances
- Improve your production throughput
- Maximize yield
- Develop the most robust and efficient process
- New process in consumable product development
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Our labs are outfitted with the latest diamond processing equipment to take you from rough grinding through final CMPD polish, including advanced metrology to document the results. Whether you are planarizing a multi-material MEMS wafer or targeting an epi-finish on exotic substrates our expert staff can assist you in meeting and exceeding your goals.
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